Advanced Interconnect and Packaging

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...

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Bibliografiska uppgifter
Materialtyp:	Online
Språk:	engelska
Utgiven:	MDPI - Multidisciplinary Digital Publishing Institute 2023
Ämnen:	antenna current transmission line model frequency-selective surface analytical approximation low-temperature soldering 3D IC Bi aggregation Sn-Bi solder integrated circuit interconnects aging reliability electromigration physics-based modeling average power handling capability (APHC) slow-wave transmission line (SWTL) thermal resistance average heat-spreading width temperature-dependent resistivity broadside structure far-end crosstalk impedance interposer channel silicon interposer vertical tabbed via on-chip interconnect carbon nanotube through-silicon-via (TSV) Cu-CNT composite Cu–Sn bonding Au–Au bonding graphene high-temperature pressure sensor substrate integrated waveguide (SIW) spoof surface plasmon polaritons (SSPPs) integrated passive device through-dielectric capacitor (TDC) electromagnetic bandgap (EBG) interposers low-loss substrates noise suppression structures packages power delivery network (PDN) power/ground noise Pt–Pt interconnection high-temperature resistant packaging metallic bonding Au wire bonding high-temperature annealing focused ion beam (FIB) morphology analysis wettability hot-melt glass flow time coverage thickness SiO2 and Au substrate MEMS sensor reliability evaluation vacuum degradation mathematical model parylene blood oxygen sensing array wearable device on-chip spiral inductor circuit model kinetic inductance quantum resistance frequency selective rasorber (FSR) spoof surface plasmon polaritons (SSPP) frequency selective surface (FSS) broadband dual active bridge deadbeat controller load feedforward n/a thema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: general thema EDItEUR::P Mathematics and Science::PH Physics
Länkar:	ONIX_20230307_9783036567334_95
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Advanced Interconnect and Packaging

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