Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated ci...
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| Format: | Online |
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| Idioma: | anglès |
| Publicat: |
MDPI - Multidisciplinary Digital Publishing Institute
2023
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| Matèries: | |
| Accés en línia: | ONIX_20230307_9783036567334_95 |
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