Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...
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| Главный автор: | |
|---|---|
| Формат: | Online |
| Язык: | английский |
| Опубликовано: |
KIT Scientific Publishing
2021
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| Предметы: | |
| Online-ссылка: | 34202 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
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