Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This...

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Bibliographic Details

Main Author:	Lindenmann, Nicole
Format:	Online
Language:	English
Published:	KIT Scientific Publishing 2021
Subjects:	T1-995 optische Aufbau- und Verbindungstechnik Photonic Wire Bonding optical interconnects photonic integrated circuits integrierte Photonik Silizium-Photonik silicon photonics photonic wire bonding thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Online Access:	34202
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