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Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short...

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Gorde:
Egile nagusia: Kohler, Tobias
Formatua: Online
Hizkuntza:alemana
Argitaratua: KIT Scientific Publishing 2023
Gaiak:
Vergussmasse; Scherfestigkeit; Primer; Alkoxysilan; Leistungselektronik; Potting Material; Shear Strength; Alkoxysilane; Power Electronics
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials
Sarrera elektronikoa:https://library.oapen.org/handle/20.500.12657/63731
Etiketak: Etiketa erantsi
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Gaia:The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.

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