Chapter MEMS Technologies Enabling the Future Wafer Test Systems

As the form factor of microelectronic systems and chips are continuing to shrink, the demand for increased connectivity and functionality shows an unabated rising trend. This is driving the evolution of technologies that requires 3D approaches for the integration of devices and system design. The 3D...

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主要な著者:	Tunaboylu, Bahadir, Soydan, Ali M.
フォーマット:	Online
言語:	英語
出版事項:	InTechOpen 2021
主題:	wafer and package test systems, MEMS technology, interconnects, interposer, wafer probes thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJF Electronics engineering::TJFC Electronics: circuits and components
オンライン･アクセス:	ONIX_20210602_10.5772/intechopen.73144_398
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