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Latest Advances in Electrothermal Models

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulati...

Szczegółowa specyfikacja

Zapisane w:
Format: Online
Język:angielski
Wydane: MDPI - Multidisciplinary Digital Publishing Institute 2021
Hasła przedmiotowe:
Dual-Phase-Lag heat transfer model
thermal simulation algorithm
thermal measurements
Finite Difference Method scheme
Grünwald–Letnikov fractional derivative
Krylov subspace-based model order reduction
algorithm efficiency analysis
relative error analysis
algorithm convergence analysis
computational complexity analysis
finite difference method scheme
BJT
modelling
self-heating
silicon carbide
SPICE
IGBT
DC–DC converter
electrothermal model
averaged model
thermal phenomena
diode–transistor switch
power electronics
multi-LED lighting modules
device thermal coupling
compact thermal models
temperature sensors
microprocessor
throughput improvement
inductors
ferromagnetic cores
thermal model
transient thermal impedance
thermal resistance
electrothermal (ET) simulation
finite-element method (FEM)
model-order reduction (MOR)
multicellular power MOSFET
silicon carbide (SiC)
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technology
Dostęp online:ONIX_20210501_9783036503349_236
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