High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...

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Bibliografiske detaljer

Hovedforfatter:	Burger, Sofie
Format:	Online
Sprog:	engelsk
Udgivet:	KIT Scientific Publishing 2021
Fag:	T1-995 damage structure Fatigue thin film cantilever bending thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Online adgang:	35355
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