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Simulation and Reliability Assessment of Advanced Packaging

Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved...

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Salvato in:
Natura: Online
Lingua:inglese
Pubblicazione: MDPI - Multidisciplinary Digital Publishing Institute 2024
Soggetti:
flip-chip package
2.5D package
thermal warpage
strain gauge
electronic packaging
dynamic storage modulus
loss tangent
optimization
bivariate cut-HDMR
semiconductor packaging
central composite design
R-squared
relative average absolute error
flip chip package on package
finite element analysis
viscoelastic behavior
process-induced warpage
trace mapping
effective modeling
solder joint fatigue risk estimation
wafer level chip-scaled packaging
artificial neural network
recurrent neural network
generic algorithm
principle component analysis
time/temperature-dependent nonlinearity
MOSFET
TSV
annealing process
carrier mobility estimation
FEM simulation
WLP
AI
machine learning
ANN
RNN
SVR
KRR
KNN
RF
regression model
electro-thermal coupling analysis
power MOSFET inverter
power loss
circuit simulation
computational fluid dynamics
Foster thermal network
Micro-Electro-Mechanical Systems
moisture sensitivity level test
reflow process
finite element method
cohesive zone model
bonding strength
precondition test
low-temperature co-fired ceramics (LTCCs)
dielectric constant
dissipation factor
numerical simulation
thermal design
thermal stress
PVT growth
AlN single crystals
flip-chip process
strip warpage
bump
Ag–In alloy pastes
mechanical alloying
power semiconductor packaging
die attachment
mechanical properties
oxidation mechanism
multiple reflows
synchrotron
composite solder
Wafer-Level Package (WLP)
Finite Element Analysis (FEA)
Kernel Ridge Regression (KRR)
Cluster algorithm
micro-joints
solid-state reaction
intermetallic
adhesion layer
Equation-Informed Neural Networks
advanced electronic packaging
numerical Bayesian Inference
constitutive equations
Pb-free SAC305 solders
thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues
Accesso online:ONIX_20240514_9783725809721_550
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